FUNMAT PRO 310 NEO

INDUSTRIAL HIGH-THROUGHPUT 3D PRINTER

INDUSTRIAL HIGH-THROUGHPUT PRINTING UNLEASHES CAPACITY LIMITS

Ideal for Small-Batch Manufacturing in Industrial Applications

High-Throughput Printing Performance

  •  Offers 12+ high-speed material processing options, achieving a productivity range of 500-1000g/day.
  •  Doubles capacity for duplicate and mirror mode, achieving over 1kg/day.
  •  Maintains perfect control over print quality and precision at high speeds, delivering reliable continuous production to meet industrial application demands.

Next-Generation Print Mainboard, Driving High-Speed Printing Innovation

  • Powered by NXP’s advanced MCU, this mainboard provides the robust computing power needed for high-speed printing.

Perfect Surface Finish with Advanced Motion Control Algorithms

  • Intelligent Speed Prediction: Predicts printing speeds based on path complexity to maintain exceptional surface quality even with intricate feature structures.
  • Flow Compensation Technology: Dynamically adjusts the material extrusion rate to prevent surface defects during high-speed printing.

UP TO 100°C CHAMBER

The active heated chamber maintains a consistent temperature up to 100°C, optimizing material properties and mechanical strength for a wide array of engineering plastics.

Full-Format Printing

  • Reduce thermal deformation and shrinkage of the model during the printing process, avoiding warping to achieve large-format (305 x 260 x 260 mm) printing.

PC Printing

  • Heated chamber at 100°C prevents warping, delamination, and deformation in long-edge PC prints over 150 mm.

Superior Mechanical Properties

  • High-temperature semi-crystalline structures provide enhanced strength and toughness.
    Consistent chamber temperatures ensure consistent mechanical performance.

EQUIPMENT PARAMETERS

Technical Parameters

Printing Technology

Fused Filament Fabrication (FFF)

Build Volume

Up to 305mm×260mm×260mm (single nozzle), 260mm×260mm×260mm (dual nozzle)

Number of Nozzles

2 Independent (IDEX)

Layer Thickness

0.1𝑚𝑚−0.3𝑚𝑚

Max Print Speed

500𝑚𝑚/𝑠

Acceleration

10,000𝑚𝑚/𝑠2

Position Resolution (XY)

16𝜇𝑚

Position Resolution (Z)

160℃/320 oF

Filament Diameter

1.75mm

Materials

PC, ABS-HS, PPA-CF / GF, PA, PPS, support materials, et. al.

Functions

  • Filament Runout Warning
  • Power Outage Continuation
  • Remote Control
  • Remote Printing
  • Online Updates

Voltage

200 - 240 V / 7 A. 50 / 60 Hz

Max Power

1500 W

Connectivity

WiFi, Ethernet, USB

Interface

7" Touchscreen

Build Plate

Magnetic Flexible Buildplate

Build Chamber

Fully Enclosed

Cooling

Fan

External Filament Box

  • Sealed box maintains humidity and temperature
  • Included Reusable Molecular Sieve
  • Real-time monitoring

Number of Spools

2x 1kg

Resolution

16nm XY, 1.25nm Z

Filtering System

HEPA + Activated Carbon (replacable)

Printer Dimensions

700mm x 655mm x 700mm